Storage and Shelf Life

 

The active ingredient which forms the chemical bond with glass and silicon is sensitive to moisture or water vapor.  Extended exposure of PHOTOCAP® encapsulant to high humidity conditions prior to heat lamination or encapsulation of the module, could result in low bond strength between the encapsulant and other surfaces in the module.  The storage conditions in this document are provided as a recommendation to protect the active primer in the PHOTOCAP encapsulant prior to lamination. 

 

 Download STR PHOTOCAP Encapsulant Storage Conditions

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 
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